행사가 개최되었습니다.
INVITATION
This year, the workshop focuses on Fan-out Package. Fan-out Packages are getting significant momentum as fine pitch, small form-factor, and heterogeneous integration solutions.
The application of Fan-out Package is expanding rapidly, ranging from small devices to high-end mobile processors and SiP modules.
High yielding integration of Fan-out Package is requiring innovative breakthroughs in all areas including IC chip design, RDL fabrication, measurement and inspection, and verification tools. Equipment and materials are key elements to be innovated.
Close collaboration among industry, universities, and research institutes is crucial to resolve those challenges.
The organizers of the workshop have invited leading experts from diverse sites to share their expertise and experiences with others who need guidance and advice.
You are cordially invited to the forum of informative lecture and open discussion with leaders in this field.
The application of Fan-out Package is expanding rapidly, ranging from small devices to high-end mobile processors and SiP modules.
High yielding integration of Fan-out Package is requiring innovative breakthroughs in all areas including IC chip design, RDL fabrication, measurement and inspection, and verification tools. Equipment and materials are key elements to be innovated.
Close collaboration among industry, universities, and research institutes is crucial to resolve those challenges.
The organizers of the workshop have invited leading experts from diverse sites to share their expertise and experiences with others who need guidance and advice.
You are cordially invited to the forum of informative lecture and open discussion with leaders in this field.
Young-Hyun Jun (President, Semiconductor Society, IEIE)
Joong-Hwee Cho (Vice President, Semiconductor Society, IEIE)
Jinsang Kim (Workshop Organizer)
Tae-Je Cho (Workshop Organizer)
Joong-Hwee Cho (Vice President, Semiconductor Society, IEIE)
Jinsang Kim (Workshop Organizer)
Tae-Je Cho (Workshop Organizer)