행사가 개최되었습니다.
PROGRAM
| TIME | TOPIC | CHAIR/SPEAKER |
| 08:30-08:55 | REGISTERATION | |
| 08:55-09:00 | Opening | Young-Hyun Jun, President (The Semiconductor Society, IEIE) |
| Session-1 : Trends and Market | ||
| 09:00-09:40 | Market and Technology Trends in Fan-out Packaging | Santosh Kumar (Yole) |
| 09:40-10:20 | Complete solution for Physical Design & Verification Challenges of High Density Advanced Packaging (HDAP) | Kyung-Rok Kim (Mentor) |
| 10:20-10:40 | COFFEE BREAK | |
| 10:40-11:10 | Electrical Characterization of RDL Interposers | Yu Se-Ho (Samsung Semiconductor, Samsung Electronics Co.LTD.) |
| 11:10-11:40 | 5G trends and required PKG and Materials | Hikara Murai (Hitachi Chemical) |
| 11:40-13:00 | LUNCH & SOCIAL | |
| Session-2 : Technology Development | ||
| 13:00-13:30 | Materials for FO Packages | Joon-Seok Oh (SEMCO) |
| 13:30-14:00 | Plating Photoresist Technology | Koumura Kazuhiko (JSR) |
| 14:00-14:30 | Various bonding processes for FO technologies in WLP and PLP | Nelson.Fan. (ASMPT) |
| 14:30-14:50 | COFFEE BREAK | |
| 14:50-15:10 | Advanced technologies in automated optical metrology & inspection for fan-out wafer-level packaging | Dario Alliata (Unity SC) |
| 15:10-15:40 | Glass Inovation for Fanout |
Jay Zhang |
| 15:40-16:10 | Closing | Prof. Joong-Whee Cho, V.President (The Semiconductor Society, IEIE) |